The application of the insulation board features: 1, there are different forms of insulation board.
Almost all kinds of resin, curing agent, modification agent system can adapt to all kinds of application of form request, ranging from extremely low viscosity to high melting point solid.
2, insulating plate curing is convenient.
Choose a variety of different curing agent, epoxy resin system can almost cured at 0 ~ 180 ℃ temperature range.
3, strong adhesion insulation board.
Inherent polar hydroxyl [in epoxy resin molecular chain
And the existence of ether bond, make its have the very high adhesion strength of various substances.
During the curing reaction of epoxy resin of low contractility, produced by the internal stress is small, it also helps to improve the adhesion strength.
4, insulation board low contractility.
Epoxy resin and curing agent used in the reaction is by direct addition reaction or resin molecules in the ring opening polymerization of epoxy base, there is no water or other volatile by-products sent out.
They are compared with those of unsaturated polyester resin and phenolic resin in the process of curing showed low contractility (
Less than 2%)
5, insulation board mechanics performance.
After curing system of epoxy resin with excellent mechanical properties.